Please use this identifier to cite or link to this item: https://doi.org/10.1149/1.1625593
Title: Magnetically Controlled Electroplating of NiFe/Cu Composite Wires
Authors: Li, X.P. 
Zhao, Z.J. 
Seet, H.L. 
Heng, W.M.
Oh, T.B.
Lee, J.Y. 
Issue Date: 2004
Citation: Li, X.P., Zhao, Z.J., Seet, H.L., Heng, W.M., Oh, T.B., Lee, J.Y. (2004). Magnetically Controlled Electroplating of NiFe/Cu Composite Wires. Electrochemical and Solid-State Letters 7 (1) : C1-C3. ScholarBank@NUS Repository. https://doi.org/10.1149/1.1625593
Abstract: The effects of magnetic field on the plating material in magnetically controlled electroplating is investigated for the fabrication of microcomposite wire used in magnetoimpedance sensing elements. Composite wires of microcopper core plated with a layer of ferromagnetic material, NiFe, are produced by electroplating with and without an external magnetic field longitudinal to the wire. The results show that the presence of a magnetic field during plating enhances the NiFe composition ratio along the plated surface, and enhances the alignment of crystal grains of the plated material and the smoothness of the plated surface. The imposed external magnetic field modifies the magnetic anisotropy of the plated layer from circumferential to longitudinal. © 2003 The Electrochemical Society. All rights reserved.
Source Title: Electrochemical and Solid-State Letters
URI: http://scholarbank.nus.edu.sg/handle/10635/89354
ISSN: 10990062
DOI: 10.1149/1.1625593
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

SCOPUSTM   
Citations

10
checked on Oct 16, 2019

WEB OF SCIENCETM
Citations

8
checked on Oct 16, 2019

Page view(s)

31
checked on Oct 12, 2019

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.