Please use this identifier to cite or link to this item: https://doi.org/10.1109/TMAG.2007.893801
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dc.titleEffect of sputtered seed layer on electrodeposited NiFe/Cu composite wires
dc.contributor.authorLi, X.P.
dc.contributor.authorYi, J.B.
dc.contributor.authorSeet, H.L.
dc.contributor.authorYin, J.H.
dc.contributor.authorThongmee, S.
dc.contributor.authorDing, J.
dc.date.accessioned2014-10-07T09:14:01Z
dc.date.available2014-10-07T09:14:01Z
dc.date.issued2007-06
dc.identifier.citationLi, X.P., Yi, J.B., Seet, H.L., Yin, J.H., Thongmee, S., Ding, J. (2007-06). Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires. IEEE Transactions on Magnetics 43 (6) : 2983-2985. ScholarBank@NUS Repository. https://doi.org/10.1109/TMAG.2007.893801
dc.identifier.issn00189464
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/85943
dc.description.abstractIn this paper, a seed-layer approach to electrodeposition of Ni 80Fe20 on Cu wires was developed. First, different thicknesses of Ni80Fe20 were directly deposited onto the Cu wires by sputtering as a seed layer. A rotation L-holder fixture was used to hold the Cu wire during sputtering. Second, a relatively thick Ni 80Fe20 layer was deposited by electrodeposition onto the Cu wire with the seed layer by sputtering. The results of surface characterization on the composite wires with a seed layer showed that the surface uniformity was greatly improved, as compared to the surfaces of electrodeposited wires without a seed layer. A low coercivity of 0.5 Oe for the composite wire with a seed layer was achieved. The electrodeposited wires with seed layers performed an enhanced MI effect of 250%, in contrast to the MI effect of 160% as achieved by electrodeposited wires without a seed layer. © 2007 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TMAG.2007.893801
dc.sourceScopus
dc.subjectElectrodeposition
dc.subjectMI
dc.subjectNiFe/Cu
dc.subjectSputtering
dc.typeConference Paper
dc.contributor.departmentMATERIALS SCIENCE AND ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/TMAG.2007.893801
dc.description.sourcetitleIEEE Transactions on Magnetics
dc.description.volume43
dc.description.issue6
dc.description.page2983-2985
dc.description.codenIEMGA
dc.identifier.isiut000246706200297
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