Effect of sputtered seed layer on electrodeposited NiFe/Cu composite wires

Abstract

In this paper, a seed-layer approach to electrodeposition of Ni 80Fe20 on Cu wires was developed. First, different thicknesses of Ni80Fe20 were directly deposited onto the Cu wires by sputtering as a seed layer. A rotation L-holder fixture was used to hold the Cu wire during sputtering. Second, a relatively thick Ni 80Fe20 layer was deposited by electrodeposition onto the Cu wire with the seed layer by sputtering. The results of surface characterization on the composite wires with a seed layer showed that the surface uniformity was greatly improved, as compared to the surfaces of electrodeposited wires without a seed layer. A low coercivity of 0.5 Oe for the composite wire with a seed layer was achieved. The electrodeposited wires with seed layers performed an enhanced MI effect of 250%, in contrast to the MI effect of 160% as achieved by electrodeposited wires without a seed layer. © 2007 IEEE.