Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2007.4469839
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dc.titleDynamic testing of solder joint strength under compression, tension and shearing
dc.contributor.authorLiu, J.F.
dc.contributor.authorShim, V.P.W.
dc.contributor.authorTan, V.B.C.
dc.contributor.authorLee, T.K.
dc.date.accessioned2014-10-07T09:13:53Z
dc.date.available2014-10-07T09:13:53Z
dc.date.issued2007
dc.identifier.citationLiu, J.F., Shim, V.P.W., Tan, V.B.C., Lee, T.K. (2007). Dynamic testing of solder joint strength under compression, tension and shearing. Proceedings of the Electronic Packaging Technology Conference, EPTC : 380-385. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469839
dc.identifier.isbn1424413249
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/85933
dc.description.abstractStudies on strain rate sensitivity of solder joints at high rates are relatively scarce. This investigation explores the possibility of establishing an experimental technique using a split Hopkinson bar to test single solder specimens. Computational simulation of tests on a cylindrical specimen the size of the solder ball is also performed to validate the assumption of one dimensional wave propagation as well as accuracy of stress-strain data derived. Tests on actual 0.24mm diameter solder balls show good repeatability of results, confirming the feasibility of applying the SHB technique. Average dynamic stress-strain curves for strain rates ranging from 102/s to 10 3/s were obtained and compared with average responses corresponding to quasi-static strain rates of 10-3 /s and 1/s for compression, tension and shear loading. Rate sensitivity of the solder ball response is observed. © 2007 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EPTC.2007.4469839
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/EPTC.2007.4469839
dc.description.sourcetitleProceedings of the Electronic Packaging Technology Conference, EPTC
dc.description.page380-385
dc.identifier.isiut000253874600069
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