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|Title:||Wedge indentation studies of low-k films at inert, water and ambient environments||Authors:||Yeap, K.B.
|Issue Date:||25-Aug-2009||Citation:||Yeap, K.B., Zeng, K., Chi, D. (2009-08-25). Wedge indentation studies of low-k films at inert, water and ambient environments. Materials Science and Engineering A 518 (1-2) : 132-138. ScholarBank@NUS Repository. https://doi.org/10.1016/j.msea.2009.04.030||Abstract:||Wedge indentation experiments are performed to study the time-dependent fracture behavior of silica-based low-k films, namely BlackDiamond® (BD) film and methysilsesquoxane (MSQ) film, both on Si substrate. Two wedge indentation tests, load-holding and varying-loading-rates tests, are performed in this study. It is found that the chemical structure of the low-k films greatly influences the crack growth during the load-holding and varying-loading-rates tests. For the MSQ/Si system, continuously increasing indentation load to above the critical load (>2 mN) is required for crack growth; while for the BD/Si system, spending excessive period of time at below the critical load (||Source Title:||Materials Science and Engineering A||URI:||http://scholarbank.nus.edu.sg/handle/10635/85838||ISSN:||09215093||DOI:||10.1016/j.msea.2009.04.030|
|Appears in Collections:||Staff Publications|
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