Please use this identifier to cite or link to this item:
https://doi.org/10.1016/j.applthermaleng.2005.10.028
DC Field | Value | |
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dc.title | New pool boiling data for water with copper-foam metal at sub-atmospheric pressures: Experiments and correlation | |
dc.contributor.author | Choon, N.K. | |
dc.contributor.author | Chakraborty, A. | |
dc.contributor.author | Aye, S.M. | |
dc.contributor.author | Xiaolin, W. | |
dc.date.accessioned | 2014-10-07T09:08:31Z | |
dc.date.available | 2014-10-07T09:08:31Z | |
dc.date.issued | 2006-08 | |
dc.identifier.citation | Choon, N.K., Chakraborty, A., Aye, S.M., Xiaolin, W. (2006-08). New pool boiling data for water with copper-foam metal at sub-atmospheric pressures: Experiments and correlation. Applied Thermal Engineering 26 (11-12) : 1286-1290. ScholarBank@NUS Repository. https://doi.org/10.1016/j.applthermaleng.2005.10.028 | |
dc.identifier.issn | 13594311 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/85481 | |
dc.description.abstract | Over the past decades, pool boiling heat transfer of water has been investigated extensively by many scientists and researchers at system pressures varying from atmospheric to near critical pressure. However, at sub-atmospheric pressures conditions there is a dearth of data, particularly when the vapour pressures are less than 10 kPa. The authors have conducted a detailed study of pool boiling of water in an evaporator where its system pressure was about 1.8 kPa. The heat flux for pool boiling was derived from an uniform radiant heaters up to 5 W/cm2 (or a total heating rate of 125 W within an area of 25 cm2), a region that is of interest for the cooling of CPUs. © 2005 Elsevier Ltd. All rights reserved. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.applthermaleng.2005.10.028 | |
dc.source | Scopus | |
dc.subject | CPU cooling | |
dc.subject | Heat transfer correlation | |
dc.subject | Pool boiling | |
dc.type | Article | |
dc.contributor.department | MECHANICAL ENGINEERING | |
dc.description.doi | 10.1016/j.applthermaleng.2005.10.028 | |
dc.description.sourcetitle | Applied Thermal Engineering | |
dc.description.volume | 26 | |
dc.description.issue | 11-12 | |
dc.description.page | 1286-1290 | |
dc.description.coden | ATENF | |
dc.identifier.isiut | 000237572400021 | |
Appears in Collections: | Staff Publications |
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