Please use this identifier to cite or link to this item: https://doi.org/10.1243/09544054JEM432SC
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dc.titleFormation of micromoulds via UV lithography of SU8 photoresist and nickel electrodeposition
dc.contributor.authorThian, S.
dc.contributor.authorTang, Y.
dc.contributor.authorFuh, J.Y.H.
dc.contributor.authorWong, Y.S.
dc.contributor.authorLoh, H.T.
dc.contributor.authorLu, L.
dc.contributor.authorTee, D.Z.S.
dc.date.accessioned2014-10-07T09:05:31Z
dc.date.available2014-10-07T09:05:31Z
dc.date.issued2006
dc.identifier.citationThian, S., Tang, Y., Fuh, J.Y.H., Wong, Y.S., Loh, H.T., Lu, L., Tee, D.Z.S. (2006). Formation of micromoulds via UV lithography of SU8 photoresist and nickel electrodeposition. Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture 220 (2) : 329-333. ScholarBank@NUS Repository. https://doi.org/10.1243/09544054JEM432SC
dc.identifier.issn09544054
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/85226
dc.description.abstractCurrent lithography methods for creating micromoulds, other than LIGA, often use glass or silicon wafer as substrates. Since they are nonconductive, a metallic seed layer is required to be deposited over the substrate for electrodeposition to take place. This paper demonstrates a new method of creating a micromould directly onto a metal substrate, which can then be immediately utilized for microinjection moulding after nickel electrodeposition. The selected metal brass substrate is machined by a single-point diamond turning process to achieve a nanosurface of 12 nm. Standard UV lithography using SU8 photoresist was then employed to create a microgear onto the brass. At approximately 20 μm depth, nickel microcavity gear of 1 mm diameter was successfully created directly onto the brass substrate, after electrodeposited in nickel solution. A pulse current deposition method at a current density of 400 A/m2 was used for the deposition process. © IMechE 2006.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1243/09544054JEM432SC
dc.sourceScopus
dc.subjectMicrocavity
dc.subjectMicroinjection moulding
dc.subjectMicromould
dc.subjectNickel electrodeposition
dc.subjectSU8
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1243/09544054JEM432SC
dc.description.sourcetitleProceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture
dc.description.volume220
dc.description.issue2
dc.description.page329-333
dc.description.codenPIBME
dc.identifier.isiut000238325600020
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