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Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2005.10.025
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dc.titleDevelopment of micro Ni80Fe20/Cu composite wire by cold-drawing
dc.contributor.authorSeet, H.L.
dc.contributor.authorLi, X.P.
dc.contributor.authorLee, K.S.
dc.contributor.authorYap, C.S.
dc.contributor.authorZheng, H.M.
dc.date.accessioned2014-10-07T09:02:44Z
dc.date.available2014-10-07T09:02:44Z
dc.date.issued2006-05-18
dc.identifier.citationSeet, H.L., Li, X.P., Lee, K.S., Yap, C.S., Zheng, H.M. (2006-05-18). Development of micro Ni80Fe20/Cu composite wire by cold-drawing. Thin Solid Films 505 (1-2) : 148-151. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2005.10.025
dc.identifier.issn00406090
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/84995
dc.description.abstractIn the development of highly sensitive bio-magnetic field sensors, extremely magnetically soft sensing elements are essential. Cold-drawn wires have been known to possess high uniformity in material composition and microstructure. In this study, Ni80Fe20/Cu composite microwires, with an overall diameter of 96 μm and a thickness ratio Ni 80Fe20/Cu/Ni80Fe20 of 1:4:1, were developed through the process of cold-drawing. The results showed that the ratio of the NiFe layer thickness to the copper core remained unchanged throughout the drawing process, the cold-drawn wire has a longitudinal anisotropy, and the permeability of permalloy in the cold-drawn wire can be enhanced by increasing the temperature in annealing. © 2005 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.tsf.2005.10.025
dc.sourceScopus
dc.subjectCold-drawing
dc.subjectComposite wires
dc.subjectMagnetic properties and measurements
dc.subjectMagneto-impedance effect
dc.subjectPermalloy
dc.typeArticle
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.tsf.2005.10.025
dc.description.sourcetitleThin Solid Films
dc.description.volume505
dc.description.issue1-2
dc.description.page148-151
dc.description.codenTHSFA
dc.identifier.isiut000236440600034
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