Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/84395
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dc.titleDependence of chemical composition ratio on electrical properties of HfO2-Al2O3 gate dielectric
dc.contributor.authorJoo, M.S.
dc.contributor.authorCho, B.J.
dc.contributor.authorYeo, C.C.
dc.contributor.authorWu, N.
dc.contributor.authorYu, H.
dc.contributor.authorZhu, C.
dc.contributor.authorLi, M.F.
dc.contributor.authorKwong, D.-L.
dc.contributor.authorBalasubramanian, N.
dc.date.accessioned2014-10-07T04:52:12Z
dc.date.available2014-10-07T04:52:12Z
dc.date.issued2003-03-01
dc.identifier.citationJoo, M.S.,Cho, B.J.,Yeo, C.C.,Wu, N.,Yu, H.,Zhu, C.,Li, M.F.,Kwong, D.-L.,Balasubramanian, N. (2003-03-01). Dependence of chemical composition ratio on electrical properties of HfO2-Al2O3 gate dielectric. Japanese Journal of Applied Physics, Part 2: Letters 42 (3 A) : L220-L222. ScholarBank@NUS Repository.
dc.identifier.issn00214922
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/84395
dc.description.abstractThe electrical properties of Hf-Al-O alloy films with various composition ratios prepared by atomic layer chemical vapor deposition (ALCVD) have been investigated to find the optimum composition ratio. The Hf-Al-O alloy with 67% composition of HfO2, (HfO2)0.67(Al2O3)0.33, shows a good thermal stability comparable to Al2O3 film and a lower amount of negative fixed charge similar to pure HfO2 film. A significant reduction in leakage current of 67%-HfO2 film compared to that of pure HfO2 film has been achieved, which is attributed to the improved thermal stability. From the results, it is found that the optimum composition ratio in Hf-Al-O alloy lies at around 60-70% of HfO2.
dc.sourceScopus
dc.subjectALCVD
dc.subjectHafnium alloy
dc.subjectHafnium oxide
dc.subjectHigh-K
dc.subjectThermal stability
dc.typeOthers
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.sourcetitleJapanese Journal of Applied Physics, Part 2: Letters
dc.description.volume42
dc.description.issue3 A
dc.description.pageL220-L222
dc.description.codenJAPLD
dc.identifier.isiutNOT_IN_WOS
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