Please use this identifier to cite or link to this item:
Title: Laser processing of polytetrafluoroethylene (Teflon) in air
Authors: Wang, Z.B.
Hong, M.H.
Lu, Y.F. 
Chong, T.C.
Keywords: Laser ablation
Teflon PTFE
Ultrashort laser
Issue Date: 2002
Citation: Wang, Z.B., Hong, M.H., Lu, Y.F., Chong, T.C. (2002). Laser processing of polytetrafluoroethylene (Teflon) in air. Proceedings of SPIE - The International Society for Optical Engineering 4830 : 544-549. ScholarBank@NUS Repository.
Abstract: Teflon, polytetrafluorethylene (PTFE), is an important material in bioscience and medical application due to its special characteristics (non-flammable, anti-adhesive, heat-resistant and bio-compatible). The advantages of ultrashort laser processing of Teflon include a minimal thermal penetration region and low processing temperatures, precision removal of material, and good-quality feature definition. In this paper, laser processing of Teflon by Ti: Sapphire femtosecond laser (780 nm, 110 fs), Nd:YAG laser (532 nm, 7 ns) and CO2 laser (10.6 μm, 10 μs) has been investigated. For femtosecond laser processing, clear ablation takes place and provides high-quality groove on Teflon surface. Both the groove depth and the width increase as the laser fluence increase, and decrease almost linearly as the scanning speed increase for laser fluences below 5.0 J/cm2. For NdrYAG processing, Teflon surface roughness is improved but no clean ablation is accessible, which makes it difficult to micromachine Teflon by Nd:YAG laser. For CO2 laser processing, laser-induced bumps were formed on Teflon surface with controlled laser parameters. The physics mechanisms for different pulse duration laser processing of Teflon are also discussed.
Source Title: Proceedings of SPIE - The International Society for Optical Engineering
ISSN: 0277786X
DOI: 10.1117/12.486544
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

checked on Jan 13, 2022

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.