Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.tsf.2005.09.157
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dc.titleDefect suppression of indium end-of-range during solid phase epitaxy annealing using Si1-yCy in silicon
dc.contributor.authorTan, C.F.
dc.contributor.authorChor, E.F.
dc.contributor.authorLee, H.
dc.contributor.authorLiu, J.
dc.contributor.authorQuek, E.
dc.contributor.authorChan, L.
dc.date.accessioned2014-10-07T04:43:04Z
dc.date.available2014-10-07T04:43:04Z
dc.date.issued2006-05-10
dc.identifier.citationTan, C.F., Chor, E.F., Lee, H., Liu, J., Quek, E., Chan, L. (2006-05-10). Defect suppression of indium end-of-range during solid phase epitaxy annealing using Si1-yCy in silicon. Thin Solid Films 504 (1-2) : 132-135. ScholarBank@NUS Repository. https://doi.org/10.1016/j.tsf.2005.09.157
dc.identifier.issn00406090
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/83603
dc.description.abstractWe report on the elimination of defect formation which is associated with high dose indium implantations under solid phase epitaxial regrowth (SPER) annealing conditions of 650-800 °C. This is achieved by incorporating a layer of epitaxially grown Si1-yCy layer, strategically located at the end-of-range (EOR) of the implant profile. An indium implant of 115 keV at 1 × 1014 cm- 2 was performed followed by annealing at temperature ranges of 650-800 °C. Samples with the Si 1-yCy layer revealed the elimination of secondary EOR defects with effectively suppressed indium transient enhanced diffusion (TED), indicating the function of carbon as an efficient sink for silicon interstitials at reduced annealing temperatures, in the SPER dopant activation regime. © 2005 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.tsf.2005.09.157
dc.sourceScopus
dc.subjectEnd-of-range
dc.subjectIndium
dc.subjectSolid phase epitaxial regrowth
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1016/j.tsf.2005.09.157
dc.description.sourcetitleThin Solid Films
dc.description.volume504
dc.description.issue1-2
dc.description.page132-135
dc.description.codenTHSFA
dc.identifier.isiut000236486200032
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