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Title: Characteristics of NEMS piezoresistive silicon nanowires pressure sensors with various diaphragm layers
Authors: Lou, L.
Zhang, S.
Lim, L.
Park, W.-T.
Feng, H.
Kwong, D.-L.
Lee, C. 
Keywords: Diaphragm
Nano-electro-mechanical systems (NEMS)
Piezoresistive silicon nanowire
Pressure sensor
Thin film
Issue Date: 2011
Citation: Lou, L., Zhang, S., Lim, L., Park, W.-T., Feng, H., Kwong, D.-L., Lee, C. (2011). Characteristics of NEMS piezoresistive silicon nanowires pressure sensors with various diaphragm layers. Procedia Engineering 25 : 1433-1436. ScholarBank@NUS Repository.
Abstract: Optimized diaphragm structures comprising silicon nitride (SiNx) film integrated with piezoresistive silicon nanowires (SiNW) are characterized for nanoelectromechanical system (NEMS) pressure sensors. Several improvements are done in comparison with our previously reported device [1]. Firstly, p-type SiNWs of 1 μm with 1E14 implantation instead of 10 μm 1E13 implantation are adopted to gain more uniform stress and show better linearity. Secondly, by using SiO 2+SiNx bi-layer film instead of pure SiO 2 film, the membrane is not only flat, but also toughened to be able to withstand pressure up to 40 atm. Finally, the real test shows that the sensitivity of pressure sensor is doubled by thinning down the SiNx film to half thickness. © 2011 Published by Elsevier Ltd.
Source Title: Procedia Engineering
ISSN: 18777058
DOI: 10.1016/j.proeng.2011.12.354
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