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Please use this identifier to cite or link to this item: https://doi.org/10.1109/EMAP.2008.4784267
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dc.titleBonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging
dc.contributor.authorLee, C.
dc.contributor.authorYu, D.
dc.contributor.authorYu, A.
dc.contributor.authorYan, L.
dc.contributor.authorWang, H.
dc.contributor.authorLau, J.H.
dc.date.accessioned2014-10-07T04:42:09Z
dc.date.available2014-10-07T04:42:09Z
dc.date.issued2008
dc.identifier.citationLee, C., Yu, D., Yu, A., Yan, L., Wang, H., Lau, J.H. (2008). Bonding interface materials evolution of intermediate In/Ag layers for low temperature fluxless solder based MEMS wafer level packaging. 2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008 : 216-219. ScholarBank@NUS Repository. https://doi.org/10.1109/EMAP.2008.4784267
dc.identifier.isbn9781424436217
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/83520
dc.description.abstractIn this paper, we proposed new intermediate bonding layers (IBLs) of Ag-rich composition in In-Ag solder systems in contrast to previous studies mainly based on eutectic composition. The intermetallic compounds (lMCs) at the bonding interface were investigated with respect to the bonding condition, post-bonding room temperature storage and post-bonding heat treatment. The IMCs of Ag21n and Ag2114 with high temperature resist to postbonding process are derived under process condition of wafer bonding at 180°C, 40mins and subsequent 120°C-130°C annealing for 24 hours. Based on our results, we can design proper packaging process flow so as to get reliable wafer level packaged MEMS devices. © 2008 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EMAP.2008.4784267
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/EMAP.2008.4784267
dc.description.sourcetitle2008 10th International Conference on Electronic Materials and Packaging, EMAP 2008
dc.description.page216-219
dc.identifier.isiut000264237400049
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