Please use this identifier to cite or link to this item:
https://doi.org/10.1109/LMWC.2005.858999
DC Field | Value | |
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dc.title | Very low noise RF nMOSFETs on pastic by substrate thinning and wafer transfer | |
dc.contributor.author | Kao, H.L. | |
dc.contributor.author | Hung, B.F. | |
dc.contributor.author | Chin, A. | |
dc.contributor.author | Lai, J.M. | |
dc.contributor.author | Lee, C.F. | |
dc.contributor.author | McAlister, S.P. | |
dc.contributor.author | Chi, C.C. | |
dc.date.accessioned | 2014-10-07T04:39:10Z | |
dc.date.available | 2014-10-07T04:39:10Z | |
dc.date.issued | 2005-11 | |
dc.identifier.citation | Kao, H.L., Hung, B.F., Chin, A., Lai, J.M., Lee, C.F., McAlister, S.P., Chi, C.C. (2005-11). Very low noise RF nMOSFETs on pastic by substrate thinning and wafer transfer. IEEE Microwave and Wireless Components Letters 15 (11) : 757-759. ScholarBank@NUS Repository. https://doi.org/10.1109/LMWC.2005.858999 | |
dc.identifier.issn | 15311309 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/83260 | |
dc.description.abstract | A very low minimum noise figure (N Fmin) of 1.2 dB and a high associated gain of 12.8 dB at 10 GHz were measured for six-finger, 0.18-μm radio frequency (RF) metal-oxide semiconductor field-effect transistors mounted on insulating plastic following substrate-thinning (∼ 30 μm) and wafer transfer. Before this process, the devices had a slightly better RF performance of 1.1-dB N Fmin and a 13.7-dB associated gain. Thesmall RF performance degradation of the active transistors transferred to plastic shows the potential of integrating electronics onto plastic. © 2005 IEEE. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/LMWC.2005.858999 | |
dc.source | Scopus | |
dc.subject | Associated gain | |
dc.subject | Metal-oxide semiconductor field-effect transistor (MOSFET) | |
dc.subject | Minimum noise figure | |
dc.subject | Plastic | |
dc.subject | Radio frequency (RF) | |
dc.type | Article | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1109/LMWC.2005.858999 | |
dc.description.sourcetitle | IEEE Microwave and Wireless Components Letters | |
dc.description.volume | 15 | |
dc.description.issue | 11 | |
dc.description.page | 757-759 | |
dc.description.coden | IMWCB | |
dc.identifier.isiut | 000233208200013 | |
Appears in Collections: | Staff Publications |
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