Please use this identifier to cite or link to this item:
https://doi.org/10.1149/2.014206esl
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dc.title | Thermally stable multi-phase nickel-platinum stanogermanide contacts for germanium-tin channel MOSFETs | |
dc.contributor.author | Wang, L. | |
dc.contributor.author | Han, G. | |
dc.contributor.author | Su, S. | |
dc.contributor.author | Zhou, Q. | |
dc.contributor.author | Yang, Y. | |
dc.contributor.author | Guo, P. | |
dc.contributor.author | Wang, W. | |
dc.contributor.author | Tong, Y. | |
dc.contributor.author | Lim, P.S.Y. | |
dc.contributor.author | Liu, B. | |
dc.contributor.author | Kong, E.Y.-J. | |
dc.contributor.author | Xue, C. | |
dc.contributor.author | Wang, Q. | |
dc.contributor.author | Cheng, B. | |
dc.contributor.author | Yeo, Y.-C. | |
dc.date.accessioned | 2014-10-07T04:38:26Z | |
dc.date.available | 2014-10-07T04:38:26Z | |
dc.date.issued | 2012 | |
dc.identifier.citation | Wang, L., Han, G., Su, S., Zhou, Q., Yang, Y., Guo, P., Wang, W., Tong, Y., Lim, P.S.Y., Liu, B., Kong, E.Y.-J., Xue, C., Wang, Q., Cheng, B., Yeo, Y.-C. (2012). Thermally stable multi-phase nickel-platinum stanogermanide contacts for germanium-tin channel MOSFETs. Electrochemical and Solid-State Letters 15 (6) : H179-H181. ScholarBank@NUS Repository. https://doi.org/10.1149/2.014206esl | |
dc.identifier.issn | 10990062 | |
dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/83198 | |
dc.description.abstract | We demonstrate a novel metal stanogermanide contact metallization process for high mobility germanium-tin (GeSn) channel MOSFETs. The multi-phase nickel-platinum stanogermanide Ni(GeSn)Pt x(GeSn) y contacts are formed by reacting Ni-Pt alloy with Ge 0.947Sn 0.053 alloy, which is epitaxially grown on Ge (100) substrate by solid source molecular beam epitaxy (MBE). Compared with nickel stanogermanide Ni(GeSn) contacts, the Pt-incorporated contacts, i.e. Ni(GeSn)Pt x(GeSn) y, exhibit enhanced thermal stability in a wide range of formation temperatures and have superior surface morphology even after thermal processing. The proposed contacts are attractive for the integration in high mobility GeSn MOSFETs. © 2012 The Electrochemical Society. | |
dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1149/2.014206esl | |
dc.source | Scopus | |
dc.type | Article | |
dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
dc.description.doi | 10.1149/2.014206esl | |
dc.description.sourcetitle | Electrochemical and Solid-State Letters | |
dc.description.volume | 15 | |
dc.description.issue | 6 | |
dc.description.page | H179-H181 | |
dc.description.coden | ESLEF | |
dc.identifier.isiut | 000306716000009 | |
Appears in Collections: | Staff Publications |
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