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|Title:||I-MOS transistor with an elevated silicon-germanium impact-ionization region for bandgap engineering||Authors:||Toh, E.-H.
Impact-ionization MOS (I-MOS)
|Issue Date:||Dec-2006||Citation:||Toh, E.-H., Wang, G.H., Chan, L., Lo, G.-Q., Samudra, G., Yeo, Y.-C. (2006-12). I-MOS transistor with an elevated silicon-germanium impact-ionization region for bandgap engineering. IEEE Electron Device Letters 27 (12) : 975-977. ScholarBank@NUS Repository. https://doi.org/10.1109/LED.2006.886708||Abstract:||An impact-ionization MOS (I-MOS) transistor with an elevated impact-ionization region (I-region) and excellent subthreshold swing of 3.2 mV/dec at room temperature is demonstrated. An elevated Si 0.75Ge0.25 region is integrated and employed to engineer the bandgap and impact-ionization rate in the I-region. Compared to a device with a Si I-region, an I-MOS device with a Si0.75Ge0.25 I-region shows significantly enhanced performance due to the smaller bandgap of the I-region and the enhanced impact-ionization rate. For the I-MOS device with a Si0.75 Ge0.25 I-region, the breakdown voltage is also reduced, and a significant drive current enhancement is achieved at VG-VT=1 V and a gate length of 80 nm. © 2006 IEEE.||Source Title:||IEEE Electron Device Letters||URI:||http://scholarbank.nus.edu.sg/handle/10635/82494||ISSN:||07413106||DOI:||10.1109/LED.2006.886708|
|Appears in Collections:||Staff Publications|
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