Please use this identifier to cite or link to this item: https://doi.org/10.1109/LMWC.2004.840981
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dc.titleHybrid FDTD-MPIE method for the simulation of locally inhomogeneous multilayer LTCC structure
dc.contributor.authorLiu, E.-X.
dc.contributor.authorLi, E.-P.
dc.contributor.authorLi, L.-W.
dc.date.accessioned2014-10-07T04:29:54Z
dc.date.available2014-10-07T04:29:54Z
dc.date.issued2005-01
dc.identifier.citationLiu, E.-X., Li, E.-P., Li, L.-W. (2005-01). Hybrid FDTD-MPIE method for the simulation of locally inhomogeneous multilayer LTCC structure. IEEE Microwave and Wireless Components Letters 15 (1) : 42-44. ScholarBank@NUS Repository. https://doi.org/10.1109/LMWC.2004.840981
dc.identifier.issn15311309
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/82480
dc.description.abstractA new hybrid finite-difference time-domain (FDTD) and mixed potential integral equation (MPIE) method is proposed for the modeling of multilayer planar circuits with locally inhomogeneous objects. By using equivalence principle, the original problem can be decomposed into two kinds of regions. The FDTD method is employed to model the locally inhomogeneous objects and construct an interaction matrix to be used in the subsequent model coupling procedure. The MPIE method with less singular kernels is applied to model the layered structure with possible perfect electric conductors. The FDTD model and the MPIE model are coupled together by enforcing the continuity of the tangential electric and magnetic fields on the equivalent surface using a Galerkin's testing procedure. Numerical results are presented to validate the proposed hybrid FDTD-MPIE method.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/LMWC.2004.840981
dc.sourceScopus
dc.subjectHybrid finite-difference time-domain (FDTD) and mixed potential integral equation (MPIE) method
dc.subjectInhomogeneous object
dc.subjectLow temperature co-fired ceramic (LTCC)
dc.subjectMultilayer structure
dc.typeArticle
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/LMWC.2004.840981
dc.description.sourcetitleIEEE Microwave and Wireless Components Letters
dc.description.volume15
dc.description.issue1
dc.description.page42-44
dc.description.codenIMWCB
dc.identifier.isiut000226296300015
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