Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.cplett.2005.11.087
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dc.titleEnhanced field emission from O2 and CF4 plasma-treated CuO nanowires
dc.contributor.authorZhu, Y.W.
dc.contributor.authorMoo, A.M.
dc.contributor.authorYu, T.
dc.contributor.authorXu, X.J.
dc.contributor.authorGao, X.Y.
dc.contributor.authorLiu, Y.J.
dc.contributor.authorLim, C.T.
dc.contributor.authorShen, Z.X.
dc.contributor.authorOng, C.K.
dc.contributor.authorWee, A.T.S.
dc.contributor.authorThong, J.T.L.
dc.contributor.authorSow, C.H.
dc.date.accessioned2014-10-07T04:27:33Z
dc.date.available2014-10-07T04:27:33Z
dc.date.issued2006-02-26
dc.identifier.citationZhu, Y.W., Moo, A.M., Yu, T., Xu, X.J., Gao, X.Y., Liu, Y.J., Lim, C.T., Shen, Z.X., Ong, C.K., Wee, A.T.S., Thong, J.T.L., Sow, C.H. (2006-02-26). Enhanced field emission from O2 and CF4 plasma-treated CuO nanowires. Chemical Physics Letters 419 (4-6) : 458-463. ScholarBank@NUS Repository. https://doi.org/10.1016/j.cplett.2005.11.087
dc.identifier.issn00092614
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/82284
dc.description.abstractThe effects of tetrafluoro methane (CF4) and oxygen (O 2) plasmas on the morphology and field emission of copper oxide (CuO) nanowires are investigated. The tip diameter of nanowires is found to be reduced and the tips sharpened by both plasmas. Furthermore, O2 plasma removes the amorphous layer on the surface of as-grown nanowires, while CF4 plasma treatment deposits a thick amorphous coating which results in a decrease in the surface work function. All these factors contribute to the large enhancement of the field emission performance after the plasma treatment. © 2005 Elsevier B.V. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.cplett.2005.11.087
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentPHYSICS
dc.contributor.departmentNUS NANOSCIENCE & NANOTECH INITIATIVE
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1016/j.cplett.2005.11.087
dc.description.sourcetitleChemical Physics Letters
dc.description.volume419
dc.description.issue4-6
dc.description.page458-463
dc.description.codenCHPLB
dc.identifier.isiut000235675000030
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