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|Title:||Novel electrical performance analysis for leaded packages||Authors:||Jin, Z.
|Issue Date:||1998||Citation:||Jin, Z.,Ma, J.,Iyer, M.K.,Ooi, B.L.,Leong, M.S. (1998). Novel electrical performance analysis for leaded packages. IEEE Topical Meeting on Electrical Performance of Electronic Packaging : 101-104. ScholarBank@NUS Repository.||Abstract:||This paper presents a novel analysis of electrical performance in 208PQFP. S-parameters are used to model the package leads. Simultaneous switching noise (SSN) is analysed both in time and frequency domain. Higher frequency effects, such as resonance and reflection are also included in this simulation study.||Source Title:||IEEE Topical Meeting on Electrical Performance of Electronic Packaging||URI:||http://scholarbank.nus.edu.sg/handle/10635/81615|
|Appears in Collections:||Staff Publications|
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