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|Title:||Novel method for Simultaneous Switching Noise analysis in electronic packages||Authors:||Jin, Zhang
Iyer, Mahadevan K.
Ooi, Ban Leong
Leong, Mook Seng
|Issue Date:||1998||Citation:||Jin, Zhang,Iyer, Mahadevan K.,Ooi, Ban Leong,Leong, Mook Seng (1998). Novel method for Simultaneous Switching Noise analysis in electronic packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 95-98. ScholarBank@NUS Repository.||Abstract:||In this paper, a novel method is described for Simultaneous Switching Noise (SSN) analysis in a 208 pin Plastic Quad Flat Package (PQFP). A two-port S matrix of the pin, and the coupling between the pins are modelled by analytical equations. SSN is analyzed as a function of switching drivers and switching time. Numerical results are presented in this paper. The application of Microwave Design System (MDS) and High Frequency Structure Simulator (HFSS) for modelling and simulating of SSN are presented in this paper.||Source Title:||Proceedings of the Electronic Packaging Technology Conference, EPTC||URI:||http://scholarbank.nus.edu.sg/handle/10635/80835|
|Appears in Collections:||Staff Publications|
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