Please use this identifier to cite or link to this item: https://doi.org/10.1109/20.490247
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dc.titleMicrocracks of the alumina of the thin-film head: study and simulation
dc.contributor.authorChekanov, A.S.
dc.contributor.authorLow, T.S.
dc.contributor.authorAlli, S.
dc.contributor.authorLiu, B.
dc.contributor.authorTeo, B.S.
dc.contributor.authorHu, S.
dc.date.accessioned2014-10-07T03:00:34Z
dc.date.available2014-10-07T03:00:34Z
dc.date.issued1995-11
dc.identifier.citationChekanov, A.S., Low, T.S., Alli, S., Liu, B., Teo, B.S., Hu, S. (1995-11). Microcracks of the alumina of the thin-film head: study and simulation. IEEE Transactions on Magnetics 31 (6 pt 1) : 2991-2993. ScholarBank@NUS Repository. https://doi.org/10.1109/20.490247
dc.identifier.issn00189464
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/80718
dc.description.abstractA study of the microcracks found in the alumina of the magnetic thin film head is presented. A model of the alumina fatigue crack initiation and growth is proposed. Thermal expansion of the energized wires leads to high stress at the pole tip area. Crack initiation usually occurs at the outer edge of the alumina, due to the mechanical damages caused by the rotating disk surface. Further crack growth is caused by fatigue in the alumina. The crack is attracted to the pole tip area, affecting the magnetic head performance. Magnetic Force Microscopy was used to study the effects of the crack on the magnetic fringe field of the head.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/20.490247
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL ENGINEERING
dc.contributor.departmentDATA STORAGE INSTITUTE
dc.description.doi10.1109/20.490247
dc.description.sourcetitleIEEE Transactions on Magnetics
dc.description.volume31
dc.description.issue6 pt 1
dc.description.page2991-2993
dc.description.codenIEMGA
dc.identifier.isiutA1995TD55600128
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