Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/80540
DC FieldValue
dc.titleHigh-performance CPW fillers use bond wires
dc.contributor.authorSivanand, K.
dc.contributor.authorUysal, S.
dc.contributor.authorEccleston, K.W.
dc.date.accessioned2014-10-07T02:58:39Z
dc.date.available2014-10-07T02:58:39Z
dc.date.issued1997
dc.identifier.citationSivanand, K.,Uysal, S.,Eccleston, K.W. (1997). High-performance CPW fillers use bond wires. Microwaves and RF 36 (6) : 89-92. ScholarBank@NUS Repository.
dc.identifier.issn07452993
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/80540
dc.description.abstractCoplanar-Waveguide (CPW) structures are becoming popular in microwave-integrated-circuit (MIC) and monolithic-MIC (MMIC) applications due to their uniplanar physical characteristics. For instance, the CPWs coplanar conductor and ground planes facilitate the grounding of shunt components. One circuit that takes advantage of this CPW property is the shunt-inductance-coupled fit ter, which is basically an end-coupled, half-wavelength-resonator filter that employs shunt inductors as coupling elements. The use of gold bond wires to realize the shunt inductors simplifies the filter design while yielding good performance.
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentELECTRICAL ENGINEERING
dc.description.sourcetitleMicrowaves and RF
dc.description.volume36
dc.description.issue6
dc.description.page89-92
dc.description.codenMIRFD
dc.identifier.isiutNOT_IN_WOS
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