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dc.titleNumerical simulation of the flip-chip underfilling process
dc.contributor.authorTay, A.A.O.
dc.contributor.authorHuang, Z.M.
dc.contributor.authorWu, J.H.
dc.contributor.authorCui, C.Q.
dc.identifier.citationTay, A.A.O.,Huang, Z.M.,Wu, J.H.,Cui, C.Q. (1997). Numerical simulation of the flip-chip underfilling process. Proceedings of the Electronic Technology Conference, EPTC : 263-269. ScholarBank@NUS Repository.
dc.description.abstractFlip chip technology is being positioned as the ultimate solution to the requirements of the electronics industry of faster, smaller, and cheaper packages. As long as the substrate in a flip chip assembly is made of some organic material, underfilling can significantly increase the fatigue life of a flip chip. This paper numerically investigates the capillary-driven flow during the underfilling process. A computer code which combines the newly proposed MAB (marker and boundary) method with the FEM (finite element method) is developed for this purpose. The computational results have shown that the underfill time is proportional to the surface tension and inversely proportional to the viscosity of the fluid. About 50% of the time is spent in filling only the last less than 10% of the cavity volume. The non-dimensional underfilling time was found to have a fixed relationship with the non-dimensional location of flow front for different kinds of underfill materials.
dc.typeConference Paper
dc.contributor.departmentINSTITUTE OF MICROELECTRONICS
dc.description.sourcetitleProceedings of the Electronic Technology Conference, EPTC
Appears in Collections:Staff Publications

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