Please use this identifier to cite or link to this item: https://doi.org/10.1109/ECTC.2006.1645809
DC FieldValue
dc.titleSuper stretched solder interconnects for wafer level packaging
dc.contributor.authorRajoo, R.
dc.contributor.authorWong, E.H.
dc.contributor.authorLim, S.S.
dc.contributor.authorHnin, W.Y.
dc.contributor.authorSeah, S.K.W.
dc.contributor.authorTay, A.A.O.
dc.contributor.authorIyer, M.
dc.contributor.authorTummala, R.R.
dc.date.accessioned2014-06-19T05:40:38Z
dc.date.available2014-06-19T05:40:38Z
dc.date.issued2006
dc.identifier.citationRajoo, R., Wong, E.H., Lim, S.S., Hnin, W.Y., Seah, S.K.W., Tay, A.A.O., Iyer, M., Tummala, R.R. (2006). Super stretched solder interconnects for wafer level packaging. Proceedings - Electronic Components and Technology Conference 2006 : 1227-1232. ScholarBank@NUS Repository. https://doi.org/10.1109/ECTC.2006.1645809
dc.identifier.isbn1424401526
dc.identifier.issn05695503
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73894
dc.description.abstractA cost-effective wafer level packaging technique termed "stretch and break", based on stretching and detachment of solder interconnections, has been established. Excellent coplanarity, essential for wafer level test and burn-in, is inherent in the process. The technique allows the freedom to use solder materials of up to 400°C melting temperature for forming the interconnection. The shape of the interconnection can also be easily manipulated for optimum performance. The mechanical and thermal cycling reliabilities of the stretched solder interconnection has been found to be significantly better than those of conventional solder joints. © 2006 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ECTC.2006.1645809
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/ECTC.2006.1645809
dc.description.sourcetitleProceedings - Electronic Components and Technology Conference
dc.description.volume2006
dc.description.page1227-1232
dc.description.codenPECCA
dc.identifier.isiut000238566601018
Appears in Collections:Staff Publications

Show simple item record
Files in This Item:
There are no files associated with this item.

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.