Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2007.4469807
DC FieldValue
dc.titleRate dependent interface delamination in plastic IC packages
dc.contributor.authorTang, S.
dc.contributor.authorGuo, T.F.
dc.contributor.authorCheng, L.
dc.date.accessioned2014-06-19T05:39:27Z
dc.date.available2014-06-19T05:39:27Z
dc.date.issued2007
dc.identifier.citationTang, S., Guo, T.F., Cheng, L. (2007). Rate dependent interface delamination in plastic IC packages. Proceedings of the Electronic Packaging Technology Conference, EPTC : 680-685. ScholarBank@NUS Repository. https://doi.org/10.1109/EPTC.2007.4469807
dc.identifier.isbn1424413249
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73797
dc.description.abstractThis paper examines the quasi-static steady-state crack growth at the interface joining viscoelastic polymeric material and hard substrates assisted by the internal vapor pressure in IC packages. Void growth and coalescence in the fracture process zone at the interface is modeled by a nonlinear viscous porous strip incorporating vapor pressure effect. The polymeric material surrounding the fracture process zone is taken as the nonlinear viscoelastic solids. To facilitate the understanding of vapor pressure, mode mixity and rate effects on the relationship between interface toughness and crack velocity, two computational models have been employed: (i) elastic background material with viscous fracture process zone (FPZ); (ii) viscoelastic background material with viscous fracture process zone. The present simulations offer some insights into viscoelastic delamination of polymer-substrate interfaces in plastic IC packages. © 2007 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EPTC.2007.4469807
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMATERIALS SCIENCE AND ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/EPTC.2007.4469807
dc.description.sourcetitleProceedings of the Electronic Packaging Technology Conference, EPTC
dc.description.page680-685
dc.identifier.isiut000253874600123
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