Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/73769
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dc.titlePredicting failure sites and failure modes in an IC package using a variable order boundary element method
dc.contributor.authorTay, A.A.O.
dc.contributor.authorLee, K.H.
dc.contributor.authorZhou, W.
dc.contributor.authorLim, K.M.
dc.date.accessioned2014-06-19T05:39:08Z
dc.date.available2014-06-19T05:39:08Z
dc.date.issued2001
dc.identifier.citationTay, A.A.O.,Lee, K.H.,Zhou, W.,Lim, K.M. (2001). Predicting failure sites and failure modes in an IC package using a variable order boundary element method. Advances in Electronic Packaging 2 : 1271-1278. ScholarBank@NUS Repository.
dc.identifier.isbn0791835405
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73769
dc.description.abstractA methodology for predicting sites of thermomechanical failure in an IC package is developed. Singular stress fields around several stress concentration locations in a typical plastic-encapsulated IC package are calculated using special variable-order singular boundary elements and the singular value decomposition method. The strain energy density distributions around all the stress concentration locations are then obtained from the singular stress fields and compared. The most likely failure site as the temperature of the package is raised is then determined as well as the likely modes of failure, ie interfacial delamination or cracking of mold compound.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleAdvances in Electronic Packaging
dc.description.volume2
dc.description.page1271-1278
dc.identifier.isiutNOT_IN_WOS
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