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Please use this identifier to cite or link to this item: https://doi.org/10.1109/APMRC.2009.4925357
DC FieldValue
dc.titleNumerical investigation of thermal problems in HAMR system
dc.contributor.authorZhang, Q.D.
dc.contributor.authorXu, B.X.
dc.contributor.authorZhang, J.
dc.contributor.authorLiu, N.Y.
dc.contributor.authorChin, G.L.
dc.contributor.authorSundaravadivelu, K.
dc.contributor.authorOng, E.H.
dc.contributor.authorLi, D.Y.
dc.date.accessioned2014-06-19T05:38:14Z
dc.date.available2014-06-19T05:38:14Z
dc.date.issued2009
dc.identifier.citationZhang, Q.D.,Xu, B.X.,Zhang, J.,Liu, N.Y.,Chin, G.L.,Sundaravadivelu, K.,Ong, E.H.,Li, D.Y. (2009). Numerical investigation of thermal problems in HAMR system. Asia-Pacific Magnetic Recording Conference, Digest of APMRC 2009 : -. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/APMRC.2009.4925357" target="_blank">https://doi.org/10.1109/APMRC.2009.4925357</a>
dc.identifier.isbn9789810821913
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73695
dc.description.abstractThe paper numerically investigated two thermal related problems in heat assisted magnetic recording: the dependence of the recorded mark width on the laser power and the temperature distribution and changes with time in lubricant layer at the condition without or with the heat sink layer. The results show that the mark width increases as the laser power increases and heat sink layer helps to reduce temperature in lubricant layer.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/APMRC.2009.4925357
dc.sourceScopus
dc.subjectHAMR
dc.subjectHeat transfer
dc.subjectLubricant
dc.subjectRecorded mark
dc.subjectSimulation
dc.subjectTemperature distribution
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.contributor.departmentDATA STORAGE INSTITUTE
dc.description.doi10.1109/APMRC.2009.4925357
dc.description.sourcetitleAsia-Pacific Magnetic Recording Conference, Digest of APMRC 2009
dc.description.page-
dc.identifier.isiutNOT_IN_WOS
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