Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/73535
DC FieldValue
dc.titleInfluence of non-uniform initial porosity distribution on adhesive failure in electronic packages
dc.contributor.authorChew, H.B.
dc.contributor.authorGuo, T.F.
dc.contributor.authorCheng, L.
dc.date.accessioned2014-06-19T05:36:17Z
dc.date.available2014-06-19T05:36:17Z
dc.date.issued2005
dc.identifier.citationChew, H.B.,Guo, T.F.,Cheng, L. (2005). Influence of non-uniform initial porosity distribution on adhesive failure in electronic packages. Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005 2 : 549-554. ScholarBank@NUS Repository.
dc.identifier.isbn0780395786
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73535
dc.description.abstractAdhesives in electronic packages contain numerous pores and cavities of various size-scales. Moisture diffuses into these voids. During reflow soldering, the simultaneous action of thermal stresses and moisture-induced internal pressure drives both pre-existing and newly nucleated voids to grow and coalesce, causing adhesive failure. In this work, a non-uniform initial porosity distribution in the adhesive is assumed. The entire adhesive is modeled by void-containing cells that incorporate vapor pressure effects on void growth and coalescence through an extended Gurson porous material model. Our computations show that increasing non-uniformity in the adhesive's initial porosity shifts the damage zone from the crack plane to sporadic sites between the crack plane and the film-substrate interfaces. For low porosity adhesives with non-uniform initial porosity distribution, internal pressure promotes extensive damage along the film-substrate interfaces. For high porosity adhesives, the combination of vapor pressure and non-uniform initial porosity distribution induces large-scale voiding throughout the adhesive, causing catastrophic failure. © 2005 IEEE.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMATERIALS SCIENCE
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleProceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
dc.description.volume2
dc.description.page549-554
dc.identifier.isiutNOT_IN_WOS
Appears in Collections:Staff Publications

Show simple item record
Files in This Item:
There are no files associated with this item.

Page view(s)

67
checked on Oct 13, 2019

Google ScholarTM

Check

Altmetric


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.