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dc.titleFracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages
dc.contributor.authorTay, A.A.O.
dc.contributor.authorZhu, H.
dc.identifier.citationTay, A.A.O.,Zhu, H. (2001). Fracture mechanics analysis of the effect of geometry on delaminations in rectangular IC packages. Proceedings - Electronic Components and Technology Conference : 620-623. ScholarBank@NUS Repository.
dc.description.abstractThis paper describes a numerical study the effect of package geometry on delaminations in plastic IC packages. A comprehensive set of linear elastic, finite element fracture analyses were carried out on a TSSOP (Thin Shrink Small Outline Package) with outer dimensions 9.7mm × 4.4mm × 1mm and die pad dimensions 5.5mm × 3mm × 0.125mm. The virtual crack closure method was used to calculate the strain energy release rate (ERR) at the tip of a small crack at the edge of the pad-encapsulant interface. A parametric analysis was carried out. Among other things, it was found that the size of the border between the die and the die pad had the greatest influence on the ERR. If this border was greater than 0.8 mm the ERR became more or less independent of the length of the die. This finding should be very useful for packaging design.
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.sourcetitleProceedings - Electronic Components and Technology Conference
Appears in Collections:Staff Publications

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