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|Title:||Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion||Authors:||Alam, M.E.
|Issue Date:||2009||Citation:||Alam, M.E.,Gupta, M. (2009). Enhancing tensile response of Sn using Cu at nano length scale and high temperature extrusion. TMS Annual Meeting : 661-668. ScholarBank@NUS Repository.||Abstract:||In the present study, 1.1 volume percent of nano size copper was incorporated into pure tin using hybrid microwave sintering assisted powder metallurgy route. Microwave sintered samples were extruded both at room temperature and at 230 °C. Microstructural characterization studies were conducted on the extruded samples to investigate the distribution characteristics of secondary phase and grain morphology. Room temperature tensile test results revealed that hot extruded Sn-Cu samples exhibited higher strengths (~ 41%, in case of 0.2% yield strength and ~ 38%, in case of ultimate tensile strength) and ductility (~ 15%) when compared to room temperature extruded samples. On the contrary, the tensile properties of pure tin remained independent of extrusion temperature. An attempt is made in this study to correlate the effect of extrusion temperature on the microstructural evolution and tensile properties of Sn-Cu solder.||Source Title:||TMS Annual Meeting||URI:||http://scholarbank.nus.edu.sg/handle/10635/73434||ISBN:||9780873397353|
|Appears in Collections:||Staff Publications|
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