Please use this identifier to cite or link to this item: https://doi.org/10.1109/EPTC.2011.6184500
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dc.titleEnhanced heat transfer and reduced pressure drop using stepped fin microchannels
dc.contributor.authorBalasubramanian, K.
dc.contributor.authorLee, P.S.
dc.contributor.authorJin, L.W.
dc.contributor.authorChou, S.K.
dc.contributor.authorTeo, C.J.
dc.contributor.authorGao, S.
dc.date.accessioned2014-06-19T05:34:59Z
dc.date.available2014-06-19T05:34:59Z
dc.date.issued2011
dc.identifier.citationBalasubramanian, K.,Lee, P.S.,Jin, L.W.,Chou, S.K.,Teo, C.J.,Gao, S. (2011). Enhanced heat transfer and reduced pressure drop using stepped fin microchannels. 2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011 : 653-659. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/EPTC.2011.6184500" target="_blank">https://doi.org/10.1109/EPTC.2011.6184500</a>
dc.identifier.isbn9781457719837
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73428
dc.description.abstractExperiments on flow boiling were conducted in straight and stepped fin microchannels. The test vehicles were made from copper with a footprint area of 25mm x 25mm. The microchannels were formed by wire cut Electro Discharge Machining process and have surface roughness (Ra) of about 2.0 μm. Tests were performed on channels having nominal width of 300 μm and a nominal aspect ratio of 4 over different mass velocity range and inlet temperature of 90°C. It was observed that the two phase pressure drop across the stepped fin microchannel heat sink was significantly lower as compared to its straight counterpart. Moreover the pressure drop and wall temperature fluctuations were seen reduced in the stepped fin microchannel heat sink. It was also noted that the stepped fin microchannel heat sink had a better heat transfer performance than the straight microchannel heat sink, under similar operating conditions. This phenomenon in stepped fin microchannel heat sink is explained based on its improved flow boiling stability that reduces the pressure drop oscillations, temperature oscillations and hence partial dry out, by allowing the bubbles to expand span wise and hence flow downstream with less resistance. © 2011 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/EPTC.2011.6184500
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/EPTC.2011.6184500
dc.description.sourcetitle2011 IEEE 13th Electronics Packaging Technology Conference, EPTC 2011
dc.description.page653-659
dc.identifier.isiutNOT_IN_WOS
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