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Please use this identifier to cite or link to this item: https://doi.org/10.1109/TRANSDUCERS.2011.5969466
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dc.titleA novel MEMS configuration for three dimensional fine positioning and mechanical fixing of a ball lens in the packaging of silicon photonics
dc.contributor.authorZhang, Q.X.
dc.contributor.authorDu, Y.
dc.contributor.authorTan, C.W.
dc.contributor.authorZhang, J.
dc.contributor.authorYu, M.B.
dc.contributor.authorLo, G.Q.
dc.contributor.authorKwong, D.L.
dc.date.accessioned2014-06-19T05:30:48Z
dc.date.available2014-06-19T05:30:48Z
dc.date.issued2011
dc.identifier.citationZhang, Q.X.,Du, Y.,Tan, C.W.,Zhang, J.,Yu, M.B.,Lo, G.Q.,Kwong, D.L. (2011). A novel MEMS configuration for three dimensional fine positioning and mechanical fixing of a ball lens in the packaging of silicon photonics. 2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 : 1795-1798. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/TRANSDUCERS.2011.5969466" target="_blank">https://doi.org/10.1109/TRANSDUCERS.2011.5969466</a>
dc.identifier.isbn9781457701573
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73069
dc.description.abstractThis paper presents a novel MEMS configuration for three dimensional on-chip fine positioning and mechanical fixing of a ball lens. A MEMS lens holder, which consists of a suspended mass, is attached onto a MEMS active alignment platform to achieve precision alignment and fixing of a ball lens with a diameter of 300μm in silicon photonics packaging. The operational principles of the system as well as the design, simulation, fabrication process of the lens holder are discussed in detail. © 2011 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TRANSDUCERS.2011.5969466
dc.sourceScopus
dc.subjectActive alignment
dc.subjectLens holder
dc.subjectMechanical locking
dc.subjectMEMS
dc.subjectPackaging
dc.subjectSi-photonics
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/TRANSDUCERS.2011.5969466
dc.description.sourcetitle2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
dc.description.page1795-1798
dc.identifier.isiutNOT_IN_WOS
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