Please use this identifier to cite or link to this item: https://doi.org/10.1109/ICSENS.2008.4716627
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dc.titleA MEMS-based bioelectrode for ECG measurement
dc.contributor.authorYu, L.M.
dc.contributor.authorTay, F.E.H.
dc.contributor.authorGuo, D.G.
dc.contributor.authorXu, L.
dc.contributor.authorNyan, M.N.
dc.contributor.authorChong, F.W.
dc.contributor.authorYap, K.L.
dc.contributor.authorXu, B.
dc.date.accessioned2014-06-19T05:30:27Z
dc.date.available2014-06-19T05:30:27Z
dc.date.issued2008
dc.identifier.citationYu, L.M.,Tay, F.E.H.,Guo, D.G.,Xu, L.,Nyan, M.N.,Chong, F.W.,Yap, K.L.,Xu, B. (2008). A MEMS-based bioelectrode for ECG measurement. Proceedings of IEEE Sensors : 1068-1071. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICSENS.2008.4716627" target="_blank">https://doi.org/10.1109/ICSENS.2008.4716627</a>
dc.identifier.isbn9781424425808
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/73038
dc.description.abstractThis paper proposes a novel micromachined physiological recording electrode with hollow microneedles for Electrocardiography (ECG) measurement. Compared to the standard commercial wet electrode and other proposed dry electrodes, a unique characteristic of this device is that a hollow microneedle array is made of silicon, which can pierce through the outer skin surface, lowering the electrode-skinelectrode impedance (ESEI) thus eliminating the need for skin preparation. Furthermore, instead of the conventional electrolytic gel, NaCl solution is used to fill the hollow microneedles and the reservoir etched in the backside of the silicon die; it is more comfortable, easy to acquire and imposes no side-effects on human. Test results of this electrode agreed well with the signal from commercial wet electrodes. This device provides a great potential for ECG measurement with cost-effective, convenience, and comfortability for health care management of aged population. © 2008 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ICSENS.2008.4716627
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/ICSENS.2008.4716627
dc.description.sourcetitleProceedings of IEEE Sensors
dc.description.page1068-1071
dc.identifier.isiutNOT_IN_WOS
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