Please use this identifier to cite or link to this item: https://scholarbank.nus.edu.sg/handle/10635/72237
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dc.titleA general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology
dc.contributor.authorLiu, J.
dc.contributor.authorCao, L.
dc.contributor.authorXie, M.
dc.contributor.authorGoh, T.-N.
dc.contributor.authorTang, Y.
dc.date.accessioned2014-06-19T04:52:39Z
dc.date.available2014-06-19T04:52:39Z
dc.date.issued2004
dc.identifier.citationLiu, J.,Cao, L.,Xie, M.,Goh, T.-N.,Tang, Y. (2004). A general Weibull model for reliability analysis under different failure criteria -application on anisotropic conductive adhesive joining technology. 2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics : 191-197. ScholarBank@NUS Repository.
dc.identifier.isbn0780387449
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/72237
dc.description.abstractIn this paper a generic four-parameter model has been developed and applied to the ACA flip-chip joining technology for electronics packaging applications. The model can also be used to predict any minimum failure cycles if the maximum acceptable failure criterion (in this case, a preset electrical resistance value) is set. The original reliability testing from which the test data was obtained was carried out on Flip-Chip anisotropically conductive adhesive joints on an FR-4 substrate. In the study, nine types of anisotropic conductive adhesive (ACA) and one non-conductive film (NCF) were used. In total, nearly one thousand single joints were subjected to reliability tests in terms of temperature cycling between -40°C and 125°C with a dwell time of 15 minutes and a ramp rate of 110°C/min. The reliability was characterized by single contact resistance measured using the four-probe method during temperature cycling testing up to 3000 cycles. A single Weibull model is used for two failure definitions defined as larger than 50mΩ and larger than 100 mΩ respectively using the in-situ electrical resistance measurement technique. The failure criteria are incorporated into this Weibull model. This study shows the flexibility and usefulness of Weibull distribution in this type of applications. © 2004 IEEE.
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentINDUSTRIAL & SYSTEMS ENGINEERING
dc.description.sourcetitle2004 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics
dc.description.page191-197
dc.identifier.isiutNOT_IN_WOS
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