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|Title:||Reliable and accurate temperature measurement using scanning thermal microscopy with double lock-in amplification||Authors:||Ho, H.W.
Scanning thermal microscopy
|Issue Date:||2009||Citation:||Ho, H.W., Zheng, X.H., Phang, J.C.H., Balk, L.J. (2009). Reliable and accurate temperature measurement using scanning thermal microscopy with double lock-in amplification. IEEE International Reliability Physics Symposium Proceedings : 804-807. ScholarBank@NUS Repository. https://doi.org/10.1109/IRPS.2009.5173354||Abstract:||A scanning thermal microscopy (SThM) technique incorporating double lock-in amplification is developed to minimize temperature drift and artifacts due to probe-sample contact area. The localized temperature change of an interconnect biased with a switching current supply is measured with improved signal level and a significant reduction of topographic artifacts. ©2009 IEEE.||Source Title:||IEEE International Reliability Physics Symposium Proceedings||URI:||http://scholarbank.nus.edu.sg/handle/10635/71609||ISBN:||0780388038||ISSN:||15417026||DOI:||10.1109/IRPS.2009.5173354|
|Appears in Collections:||Staff Publications|
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