Please use this identifier to cite or link to this item: https://doi.org/10.1109/ICPE.2011.5944472
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dc.titleRealistic simulation on reverse characteristics of SiC/GaN p-n junctions for high power semiconductor devices
dc.contributor.authorWei, G.
dc.contributor.authorLiang, Y.C.
dc.contributor.authorSamudra, G.S.
dc.date.accessioned2014-06-19T03:25:05Z
dc.date.available2014-06-19T03:25:05Z
dc.date.issued2011
dc.identifier.citationWei, G.,Liang, Y.C.,Samudra, G.S. (2011). Realistic simulation on reverse characteristics of SiC/GaN p-n junctions for high power semiconductor devices. 8th International Conference on Power Electronics - ECCE Asia: "Green World with Power Electronics", ICPE 2011-ECCE Asia : 1464-1468. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICPE.2011.5944472" target="_blank">https://doi.org/10.1109/ICPE.2011.5944472</a>
dc.identifier.isbn9781612849560
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/71559
dc.description.abstractThis paper presents a practical methodology for realistic simulation on reverse characteristics of Wide Bandgap (WBG) SiC/GaN p-n junctions. The adjustment on certain physic-based model parameters, such as the trap density and photo-generation for SiC junction, and impact ionization coefficients and critical field for GaN junction are described. The adjusted parameters were used in Synopsys Medici simulation to obtain a realistic p-n junction avalanche breakdown voltage. The simulation results were verified through benchmarking against independent data reported by others. © 2011 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ICPE.2011.5944472
dc.sourceScopus
dc.subjectHigh voltage p-n junction
dc.subjectSiC/GaN diode simulation
dc.subjectWBG power semiconductor
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/ICPE.2011.5944472
dc.description.sourcetitle8th International Conference on Power Electronics - ECCE Asia: "Green World with Power Electronics", ICPE 2011-ECCE Asia
dc.description.page1464-1468
dc.identifier.isiutNOT_IN_WOS
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