Please use this identifier to cite or link to this item:
https://doi.org/10.1109/ICPE.2011.5944472
Title: | Realistic simulation on reverse characteristics of SiC/GaN p-n junctions for high power semiconductor devices | Authors: | Wei, G. Liang, Y.C. Samudra, G.S. |
Keywords: | High voltage p-n junction SiC/GaN diode simulation WBG power semiconductor |
Issue Date: | 2011 | Citation: | Wei, G.,Liang, Y.C.,Samudra, G.S. (2011). Realistic simulation on reverse characteristics of SiC/GaN p-n junctions for high power semiconductor devices. 8th International Conference on Power Electronics - ECCE Asia: "Green World with Power Electronics", ICPE 2011-ECCE Asia : 1464-1468. ScholarBank@NUS Repository. https://doi.org/10.1109/ICPE.2011.5944472 | Abstract: | This paper presents a practical methodology for realistic simulation on reverse characteristics of Wide Bandgap (WBG) SiC/GaN p-n junctions. The adjustment on certain physic-based model parameters, such as the trap density and photo-generation for SiC junction, and impact ionization coefficients and critical field for GaN junction are described. The adjusted parameters were used in Synopsys Medici simulation to obtain a realistic p-n junction avalanche breakdown voltage. The simulation results were verified through benchmarking against independent data reported by others. © 2011 IEEE. | Source Title: | 8th International Conference on Power Electronics - ECCE Asia: "Green World with Power Electronics", ICPE 2011-ECCE Asia | URI: | http://scholarbank.nus.edu.sg/handle/10635/71559 | ISBN: | 9781612849560 | DOI: | 10.1109/ICPE.2011.5944472 |
Appears in Collections: | Staff Publications |
Show full item record
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.