Please use this identifier to cite or link to this item:
Title: Non-invasive acoustic phonon characterization of dynamic MEMS
Authors: Wong, W.K. 
Palaniapan, M. 
Wong, C.L.
Wang, S.R.
Tay, F.E.H. 
Issue Date: 2006
Citation: Wong, W.K.,Palaniapan, M.,Wong, C.L.,Wang, S.R.,Tay, F.E.H. (2006). Non-invasive acoustic phonon characterization of dynamic MEMS. Conference Proceedings from the International Symposium for Testing and Failure Analysis 2006 : 6-12. ScholarBank@NUS Repository.
Abstract: This paper describes an acoustic phonon-based characterization technique as a novel tool for the characterization of dynamic microelectromechanical (MEMS) devices such as resonators, switches, micromirrors, accelerometers and gyroscopes. The technique intrinsically features non-invasive characterization due to the favorable transmission properties of acoustic phonons through device packaging and high throughput due to universal detectability from a single detection point, which facilitates high volume wafer and package level testing. The dependence of phonon generation on material properties yields information not obtained in existing electrical, optical and electron beam testing techniques such as contact tribology, energy dissipation, non-linear device behavior and device resonance modes. Preliminary case study results show that phonon-based characterization not only provides efficient, non-destructive testing (NDT) of MEMS functionality, but also insights into MEMS device lifecycle behavior. Copyright © 2006 ASM International®.
Source Title: Conference Proceedings from the International Symposium for Testing and Failure Analysis
ISBN: 0871708442
Appears in Collections:Staff Publications

Show full item record
Files in This Item:
There are no files associated with this item.

Page view(s)

checked on Aug 18, 2019

Google ScholarTM



Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.