Please use this identifier to cite or link to this item: https://doi.org/10.1109/SENSOR.2007.4300145
DC FieldValue
dc.titleNon-destructive functionality and reliability assessment of dynamic MEMS using acoustic phonon characterization
dc.contributor.authorWong, W.-K.
dc.contributor.authorWong, C.-L.
dc.contributor.authorPalaniapan, M.
dc.contributor.authorTay, F.E.H.
dc.date.accessioned2014-06-19T03:20:23Z
dc.date.available2014-06-19T03:20:23Z
dc.date.issued2007
dc.identifier.citationWong, W.-K.,Wong, C.-L.,Palaniapan, M.,Tay, F.E.H. (2007). Non-destructive functionality and reliability assessment of dynamic MEMS using acoustic phonon characterization. TRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems : 371-374. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/SENSOR.2007.4300145" target="_blank">https://doi.org/10.1109/SENSOR.2007.4300145</a>
dc.identifier.isbn1424408423
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/71149
dc.description.abstractThis paper introduces a novel technique for dynamic motion characterization of microelectromechanical (MEMS) devices such as resonators, switches, micromirrors, accelerometers and gyroscopes. Due to the favorable generation and transmission of acoustic phonons through solids, characterization of individual MEMS devices for both dies and packaged devices can be attained noninvasively. Hence, this technique can be utilized for high volume wafer and package-level testing in MEMS manufacturing, allowing new test functionalities and cost economies in back-end wafer and package yield screens to be attained. ©2007 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/SENSOR.2007.4300145
dc.sourceScopus
dc.subjectAcoustic phonons
dc.subjectNon-destructive testing
dc.subjectResonators
dc.subjectRF switches
dc.subjectSEM
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.contributor.departmentMECHANICAL ENGINEERING
dc.description.doi10.1109/SENSOR.2007.4300145
dc.description.sourcetitleTRANSDUCERS and EUROSENSORS '07 - 4th International Conference on Solid-State Sensors, Actuators and Microsystems
dc.description.page371-374
dc.identifier.isiutNOT_IN_WOS
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