Please use this identifier to cite or link to this item: https://doi.org/10.1109/TII.2010.2040285
DC FieldValue
dc.titleMulti-zone thermal processing in semiconductor manufacturing: Bias estimation
dc.contributor.authorYan, H.
dc.contributor.authorHo, W.K.
dc.contributor.authorLing, K.V.
dc.contributor.authorLim, K.W.
dc.date.accessioned2014-06-19T03:19:35Z
dc.date.available2014-06-19T03:19:35Z
dc.date.issued2010-05
dc.identifier.citationYan, H., Ho, W.K., Ling, K.V., Lim, K.W. (2010-05). Multi-zone thermal processing in semiconductor manufacturing: Bias estimation. IEEE Transactions on Industrial Informatics 6 (2) : 216-228. ScholarBank@NUS Repository. https://doi.org/10.1109/TII.2010.2040285
dc.identifier.issn15513203
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/71078
dc.description.abstractTemperature uniformities within a wafer and from wafer to wafer have significant impact on the smallest feature size or critical dimension of integrated circuits. These are important issues with stringent specifications. To obtain temperature uniformity, a wafer is heated by multiple independently controlled heating elements simultaneously. The accuracy of temperature sensing is hence an important issue. In this paper, sensor bias is estimated for the difficult problem where measurement outliers are close to good data such that they cannot be separated easily. Equations are derived to predict the variance of the estimates from sample size. This information enables the selection of an efficient estimator. Sensor bias estimation efficiency translates into earlier bias removal and less faulty wafers. The theory is verified experimentally in a multi-zone thermal system for semiconductor wafer processing. © 2006 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/TII.2010.2040285
dc.sourceScopus
dc.subjectMulti-zone
dc.subjectRobust bias estimator
dc.subjectSemiconductor manufacturing
dc.subjectSensor bias
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/TII.2010.2040285
dc.description.sourcetitleIEEE Transactions on Industrial Informatics
dc.description.volume6
dc.description.issue2
dc.description.page216-228
dc.identifier.isiut000277343800010
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