Please use this identifier to cite or link to this item: https://doi.org/10.1109/IECON.2007.4459962
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dc.titleMeasurement bias detection, identification and elimination for multi-zone thermal processing in semiconductor manufacturing
dc.contributor.authorHo, W.K.
dc.contributor.authorYan, H.
dc.contributor.authorRomagnoli, J.A.
dc.contributor.authorLing, K.V.
dc.date.accessioned2014-06-19T03:17:32Z
dc.date.available2014-06-19T03:17:32Z
dc.date.issued2007
dc.identifier.citationHo, W.K., Yan, H., Romagnoli, J.A., Ling, K.V. (2007). Measurement bias detection, identification and elimination for multi-zone thermal processing in semiconductor manufacturing. IECON Proceedings (Industrial Electronics Conference) : 2678-2682. ScholarBank@NUS Repository. https://doi.org/10.1109/IECON.2007.4459962
dc.identifier.isbn1424407834
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70897
dc.description.abstractTemperature uniformity within wafer and from wafer to wafer are important issues with stringent specifications and significant impact on the smallest feature size or critical dimension. To obtain temperature uniformity, a wafer is heated by multiple independently controlled heating elements simultaneously. The accuracy of temperature measurement is an issue. Faults include sensor bias, complete failure, drifting, precision degradation etc. In this paper, we demonstrate the detection of gross errors and the elimination of biased reading in a multi-zone thermal system for semiconductor wafer processing. ©2007 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/IECON.2007.4459962
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/IECON.2007.4459962
dc.description.sourcetitleIECON Proceedings (Industrial Electronics Conference)
dc.description.page2678-2682
dc.description.codenIEPRE
dc.identifier.isiut000253451402109
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