Please use this identifier to cite or link to this item: https://doi.org/10.1117/12.456834
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dc.titleLaser reflow plastic ball grid array
dc.contributor.authorLiu, D.
dc.contributor.authorChen, T.
dc.contributor.authorYuan, Y.
dc.contributor.authorLu, Y.F.
dc.contributor.authorHong, M.
dc.contributor.authorGoh, R.
dc.date.accessioned2014-06-19T03:15:59Z
dc.date.available2014-06-19T03:15:59Z
dc.date.issued2002
dc.identifier.citationLiu, D., Chen, T., Yuan, Y., Lu, Y.F., Hong, M., Goh, R. (2002). Laser reflow plastic ball grid array. Proceedings of SPIE - The International Society for Optical Engineering 4426 : 363-366. ScholarBank@NUS Repository. https://doi.org/10.1117/12.456834
dc.identifier.issn0277786X
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70766
dc.description.abstractA modified fast-modulated CW Nd:YAG is used to reflow plastic ball grid array (PBGA). Sn-Pb eutectic solder balls with a diameter of 760 μm and Au-Ni-Cu solder pads are used in the study. Shear strength tests are performed to find out the optimal reflow parameters. An energy equilibrium model is proposed to estimate the average temperatures of solder joint under the given experimental conditions. Based on the experimental and theoretical results, a parameter range for laser reflow of the 760 μm SnPb eutectic solder balls is proposed.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1117/12.456834
dc.sourceScopus
dc.subjectLaser reflow
dc.subjectPlastic ball grid array
dc.subjectSn-Pb eutectic solder ball
dc.typeConference Paper
dc.contributor.departmentDATA STORAGE INSTITUTE
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1117/12.456834
dc.description.sourcetitleProceedings of SPIE - The International Society for Optical Engineering
dc.description.volume4426
dc.description.page363-366
dc.description.codenPSISD
dc.identifier.isiut000176422100078
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