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|Title:||Integrated metrology and processes for semiconductor manufacturing||Authors:||Ho, W.K.
|Issue Date:||2005||Citation:||Ho, W.K.,Tay, A.,Lim, K.W.,Loh, A.P.,Tan, W.W. (2005). Integrated metrology and processes for semiconductor manufacturing. IECON Proceedings (Industrial Electronics Conference) 2005 : 2278-2281. ScholarBank@NUS Repository. https://doi.org/10.1109/IECON.2005.1569258||Abstract:||The 2003 International Technology Road map for Semiconductors, stated under the Section Grand Challenges that real-time in-situ, integrated, and in-line metrology is required for manufacturing. The 2003 report of the international panel on future directions in control, dynamics and systems has identified that the use of control is critical to future progress in the semiconductor sectors. Modeling plays a crucial role and control techniques must make use of increase in-situ measurements to control at a variety of temporal and spatial scales. This paper gives two examples of research on integrated metrology and processes that address some of the challenges. An integrated bake/chill/spin module and in-situ metrology for photoresist thickness will be discussed. © 2005 IEEE.||Source Title:||IECON Proceedings (Industrial Electronics Conference)||URI:||http://scholarbank.nus.edu.sg/handle/10635/70621||ISBN:||0780392523||DOI:||10.1109/IECON.2005.1569258|
|Appears in Collections:||Staff Publications|
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