Please use this identifier to cite or link to this item: https://doi.org/10.1116/1.3117354
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dc.titleIntegrated bake/chill system for across-wafer temperature uniformity control in photoresist processing
dc.contributor.authorChua, H.T.
dc.contributor.authorTay, A.
dc.contributor.authorWang, Y.
dc.date.accessioned2014-06-19T03:14:13Z
dc.date.available2014-06-19T03:14:13Z
dc.date.issued2009
dc.identifier.citationChua, H.T., Tay, A., Wang, Y. (2009). Integrated bake/chill system for across-wafer temperature uniformity control in photoresist processing. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 (3) : 1211-1214. ScholarBank@NUS Repository. https://doi.org/10.1116/1.3117354
dc.identifier.issn10711023
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70618
dc.description.abstractAn integrated bake/chill thermal processing module is developed and experimentally evaluated to achieve spatial temperature uniformity of a silicon wafer throughout the entire processing temperature cycle of ramp, hold, and quench in lithography. The module uses a set of thermoelectric devices which are used to provide distributed heating and cooling to the substrate for uniformity and transient temperature control. The experimental results demonstrate that the wafer spatial temperature uniformity is within ±0.3 and ±0.1 °C during transient and steady-state thermal processing, respectively. © 2009 American Vacuum Society.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1116/1.3117354
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1116/1.3117354
dc.description.sourcetitleJournal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures
dc.description.volume27
dc.description.issue3
dc.description.page1211-1214
dc.description.codenJVTBD
dc.identifier.isiut000266500300036
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