Please use this identifier to cite or link to this item:
|Title:||Integrated bake/chill system for across-wafer temperature uniformity control in photoresist processing||Authors:||Chua, H.T.
|Issue Date:||2009||Citation:||Chua, H.T., Tay, A., Wang, Y. (2009). Integrated bake/chill system for across-wafer temperature uniformity control in photoresist processing. Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures 27 (3) : 1211-1214. ScholarBank@NUS Repository. https://doi.org/10.1116/1.3117354||Abstract:||An integrated bake/chill thermal processing module is developed and experimentally evaluated to achieve spatial temperature uniformity of a silicon wafer throughout the entire processing temperature cycle of ramp, hold, and quench in lithography. The module uses a set of thermoelectric devices which are used to provide distributed heating and cooling to the substrate for uniformity and transient temperature control. The experimental results demonstrate that the wafer spatial temperature uniformity is within ±0.3 and ±0.1 °C during transient and steady-state thermal processing, respectively. © 2009 American Vacuum Society.||Source Title:||Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures||URI:||http://scholarbank.nus.edu.sg/handle/10635/70618||ISSN:||10711023||DOI:||10.1116/1.3117354|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Aug 12, 2020
WEB OF SCIENCETM
checked on Aug 4, 2020
checked on Aug 2, 2020
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.