Please use this identifier to cite or link to this item: https://doi.org/10.1109/ICCA.2010.5524378
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dc.titleEquipment design and process control of critical dimensions in lithography
dc.contributor.authorNgo, Y.S.
dc.contributor.authorYang, G.
dc.contributor.authorPutra, A.S.
dc.contributor.authorAng, K.T.
dc.contributor.authorTay, A.
dc.contributor.authorFang, Z.P.
dc.date.accessioned2014-06-19T03:09:19Z
dc.date.available2014-06-19T03:09:19Z
dc.date.issued2010
dc.identifier.citationNgo, Y.S.,Yang, G.,Putra, A.S.,Ang, K.T.,Tay, A.,Fang, Z.P. (2010). Equipment design and process control of critical dimensions in lithography. 2010 8th IEEE International Conference on Control and Automation, ICCA 2010 : 1572-1577. ScholarBank@NUS Repository. <a href="https://doi.org/10.1109/ICCA.2010.5524378" target="_blank">https://doi.org/10.1109/ICCA.2010.5524378</a>
dc.identifier.isbn9781424451951
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/70194
dc.description.abstractThe lithography sequence is the most critical step in the fabrication of nanostructures for integrated circuit manufacturing. In this paper, we present the development of in-situ real-time sensors and actuating sytems for real-time monitoring and control of the single most critical parameter in the lithography sequence: the critical dimension (CD) or linewidth of the structures. The use of an in-situ non-destructive technique also ensures that wafer contamination during production is minimal. A spectroscopic ellipsometer is developed to monitor these nanostructures during their formation in-situ and in real-time. Coupled with the development of a programmable multizone thermal processing system, we demonstrated that these nanostructures can be manipulated in real-time during processing. This is an signifcant improvement to current monitoring and control techniques which are typically run-to-run or wafer-to-wafer; features are measured off-line and equipment setpoints adjusted for the next batch of wafers. © 2010 IEEE.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/ICCA.2010.5524378
dc.sourceScopus
dc.typeConference Paper
dc.contributor.departmentDEAN'S OFFICE (ENGINEERING)
dc.contributor.departmentELECTRICAL & COMPUTER ENGINEERING
dc.description.doi10.1109/ICCA.2010.5524378
dc.description.sourcetitle2010 8th IEEE International Conference on Control and Automation, ICCA 2010
dc.description.page1572-1577
dc.identifier.isiutNOT_IN_WOS
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