Please use this identifier to cite or link to this item:
https://doi.org/10.1016/j.proeng.2010.09.184
| DC Field | Value | |
|---|---|---|
| dc.title | A 3-D MEMS VOA using translational attenuation mechanism based on piezoelectric PZT thin film actuators | |
| dc.contributor.author | Koh, K.H. | |
| dc.contributor.author | Lee, C. | |
| dc.contributor.author | Kobayashi, T. | |
| dc.date.accessioned | 2014-06-19T02:52:20Z | |
| dc.date.available | 2014-06-19T02:52:20Z | |
| dc.date.issued | 2010 | |
| dc.identifier.citation | Koh, K.H., Lee, C., Kobayashi, T. (2010). A 3-D MEMS VOA using translational attenuation mechanism based on piezoelectric PZT thin film actuators. Procedia Engineering 5 : 613-616. ScholarBank@NUS Repository. https://doi.org/10.1016/j.proeng.2010.09.184 | |
| dc.identifier.issn | 18777058 | |
| dc.identifier.uri | http://scholarbank.nus.edu.sg/handle/10635/68708 | |
| dc.description.abstract | A silicon micromirror (5mm x 5mm) with gold coating, actuated by piezoelectric Pb(Zr,Ti)O3 cantilever beams, has been demonstrated for variable optical attenuator (VOA) applications. The device is micromachined from a SOI substrate of 5?m thick Si device layer, with multilayers of Pt/Ti/PZT/Pt/Ti being deposited for use as electrodes. The PZT thin film is deposited by solgel technique and the microstructures are later released from the backside to form a 1x10 array of PZT cantilever arranged in parallel. A piezoelectric constant value of 116pmV-1 was estimated and an attenuation of 40dB was reached when a DC driving voltage of 1V was applied to the top electrodes of all the ten cantilevers while the bottom electrodes are grounded. | |
| dc.description.uri | http://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.proeng.2010.09.184 | |
| dc.source | Scopus | |
| dc.subject | Microelectromechanical Systems (MEMS) | |
| dc.subject | Optical MEMS | |
| dc.subject | Piezoelectric actuator | |
| dc.subject | Variable optical attenuator (VOA) | |
| dc.type | Conference Paper | |
| dc.contributor.department | ELECTRICAL & COMPUTER ENGINEERING | |
| dc.description.doi | 10.1016/j.proeng.2010.09.184 | |
| dc.description.sourcetitle | Procedia Engineering | |
| dc.description.volume | 5 | |
| dc.description.page | 613-616 | |
| dc.identifier.isiut | 000287162400152 | |
| Appears in Collections: | Staff Publications | |
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