Please use this identifier to cite or link to this item:
|Title:||A concise process technology for 3-D suspended radio frequency micro-inductors on silicon substrate||Authors:||Liang, Y.C.
|Keywords:||Micro-electrical-mechanical systems (MEMS)
Radio frequency integrated circuit (RFIC)
System on a chip (SOC)
|Issue Date:||Dec-2002||Citation:||Liang, Y.C., Zeng, W., Ong, P.H., Gao, Z., Cai, J., Balasubramanian, N. (2002-12). A concise process technology for 3-D suspended radio frequency micro-inductors on silicon substrate. IEEE Electron Device Letters 23 (12) : 700-703. ScholarBank@NUS Repository. https://doi.org/10.1109/LED.2002.805748||Abstract:||In this letter, a concise process technology is proposed for the first time to enable the fabrication of good quality three-dimensional (3-D) suspended radio frequency (RF) micro-inductors on bulk silicon, without utilizing the lithography process on sidewall and trench-bottom patterning. Samples were fabricated to demonstrate the applicability of the proposed process technology.||Source Title:||IEEE Electron Device Letters||URI:||http://scholarbank.nus.edu.sg/handle/10635/67818||ISSN:||07413106||DOI:||10.1109/LED.2002.805748|
|Appears in Collections:||Staff Publications|
Show full item record
Files in This Item:
There are no files associated with this item.
checked on Jul 6, 2020
WEB OF SCIENCETM
checked on Jun 29, 2020
checked on Jun 28, 2020
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.