Please use this identifier to cite or link to this item: https://doi.org/10.1016/j.optlastec.2004.01.017
DC FieldValue
dc.titleOptical evaluation of ingot fixity in semiconductor wafer slicing
dc.contributor.authorNg, T.W.
dc.contributor.authorNallathamby, R.
dc.date.accessioned2014-06-18T05:09:23Z
dc.date.available2014-06-18T05:09:23Z
dc.date.issued2004-11
dc.identifier.citationNg, T.W., Nallathamby, R. (2004-11). Optical evaluation of ingot fixity in semiconductor wafer slicing. Optics and Laser Technology 36 (8) : 641-645. ScholarBank@NUS Repository. https://doi.org/10.1016/j.optlastec.2004.01.017
dc.identifier.issn00303992
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/67788
dc.description.abstractThe fixity of an ingot may greatly affect the quality of wafers produced during a wire saw process and improved mechanical clamping is a means for improving ingot fixity. Here, an optical technique that is based on laser beam deflection is described. The technique was demonstrated on ingot assemblies subjected to impulse loads within a prescribed range using an original and improved clamping system. The technique revealed that the ingot assembly had lower degrees of mean displacement and standard displacement deviation under the improved clamping system. The data on warp obtained from the actual production of wafers corroborates this finding. The technique described is an effective method of quantitatively evaluating the fixity of ingots in a wafer wire saw process. © 2004 Elsevier Ltd. All rights reserved.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1016/j.optlastec.2004.01.017
dc.sourceScopus
dc.subjectIngot fixity
dc.subjectOptical deflection
dc.subjectOptical metrology
dc.subjectWafer slicing
dc.typeArticle
dc.contributor.departmentBACHELOR OF TECHNOLOGY PROGRAMME
dc.description.doi10.1016/j.optlastec.2004.01.017
dc.description.sourcetitleOptics and Laser Technology
dc.description.volume36
dc.description.issue8
dc.description.page641-645
dc.description.codenOLTCA
dc.identifier.isiut000223756400007
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