Please use this identifier to cite or link to this item: https://doi.org/10.1109/6040.763194
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dc.titleSurface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper
dc.contributor.authorLiu, Y.X.
dc.contributor.authorKang, E.T.
dc.contributor.authorNeoh, K.G.
dc.contributor.authorZhang, J.F.
dc.contributor.authorCui, C.Q.
dc.contributor.authorLim, T.B.
dc.date.accessioned2014-06-17T08:34:52Z
dc.date.available2014-06-17T08:34:52Z
dc.date.issued1999
dc.identifier.citationLiu, Y.X., Kang, E.T., Neoh, K.G., Zhang, J.F., Cui, C.Q., Lim, T.B. (1999). Surface graft copolymerization enhanced adhesion of an epoxy-based printed circuit board substrate (FR-4) to copper. IEEE Transactions on Advanced Packaging 22 (2) : 214-220. ScholarBank@NUS Repository. https://doi.org/10.1109/6040.763194
dc.identifier.issn15213323
dc.identifier.urihttp://scholarbank.nus.edu.sg/handle/10635/66824
dc.description.abstractThe lamination of surface modified printed circuit board (PCB) substrate, FR-4, from argon plasma pretreatment and UV-induced graft copolymerization with glycidyl methacrylate (GMA), to copper foil was carried out at elevated temperature and in the presence of an epoxy adhesive. The structure and chemical composition of the graft copolymerized surfaces and interfaces of the glass fiber-reinforced and epoxy-based FR-4 substrates were studied by X-ray photoelectron spectroscopy (XPS). The effects of the plasma pretreatment time, the UV illumination time, as well as the curing temperature, on the adhesion strength between the FR-4 substrate and copper were investigated. The assemblies involving GMA graft copolymerized FR-4, or the FR-4-GMA/epoxy resin/Cu assemblies, exhibited a significantly higher interfacial adhesion strength and reliability, in comparison to those assemblies in which only epoxy adhesive alone was used. The enhanced adhesion in the assemblies involving GMA graft copolymerized substrate arises from the fact that the covalently tethered GMA graft chains on the FR-4 surface can become covalently incorporated into the epoxy resin, resulting in the toughening of the epoxy matrix and increased interaction with copper.
dc.description.urihttp://libproxy1.nus.edu.sg/login?url=http://dx.doi.org/10.1109/6040.763194
dc.sourceScopus
dc.typeArticle
dc.contributor.departmentCHEMICAL & ENVIRONMENTAL ENGINEERING
dc.contributor.departmentINSTITUTE OF MICROELECTRONICS
dc.description.doi10.1109/6040.763194
dc.description.sourcetitleIEEE Transactions on Advanced Packaging
dc.description.volume22
dc.description.issue2
dc.description.page214-220
dc.description.codenITAPF
dc.identifier.isiut000080640000016
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